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| IPD50N06S3L-08 OptiMOS(R)-T Power-Transistor Product Summary V DS R DS(on),max ID 55 7.8 50 V m A Features * N-channel - Logic Level - Enhancement mode * Automotive AEC Q101 qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green package (RoHS compliant) * Ultra low Rds(on) * 100% Avalanche tested PG-TO252-3-11 Type IPD50N06S3L-08 Package PG-TO252-3-11 Marking 3N06L08 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current1) Symbol ID Conditions T C=25 C, V GS=10 V T C=100 C, V GS=10 V2) Pulsed drain current2) Avalanche energy, single pulse2) Avalanche current, single pulse Gate source voltage3) Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS I AS V GS P tot T j, T stg T C=25 C T C=25 C I D=25 A Value 50 50 200 370 50 16 107 -55 ... +175 55/175/56 mJ A V W C Unit A Rev. 1.1 page 1 2009-05-20 IPD50N06S3L-08 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics2) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area4) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=55 A V DS=55 V, V GS=0 V, T j=25 C V DS=55 V, V GS=0 V, T j=125 C2) Gate-source leakage current Drain-source on-state resistance I GSS R DS(on) V GS=16 V, V DS=0 V V GS=5 V, I D=29 A V GS=10 V, I D=43 A 55 1.2 1.7 0.01 2.2 1 A V 1.4 62 40 K/W - 1 1 11.2 6.4 100 100 14 7.8 nA m Rev. 1.1 page 2 2009-05-20 IPD50N06S3L-08 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics2) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current2) Diode pulse current2) Diode forward voltage Reverse recovery time2) Reverse recovery charge2) 1) C iss C oss Crss t d(on) tr t d(off) tf V DD=27.5 V, V GS=10 V, I D=50 A, R G=5.1 V GS=0 V, V DS=25 V, f =1 MHz - 6475 812 775 17 43 47 50 7450 1220 1160 - pF ns Q gs Q gd Qg V plateau V DD=11 V, I D=50 A, V GS=0 to 10 V - 30 17 90 4.3 40 26 110 - nC V IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=50 A, T j=25 C V R=27.5 V, I F=I S, di F/dt =100 A/s 0.6 - 0.9 40 50 50 200 1.3 - A V ns nC Current is limited by bondwire; with an R thJC = 1.4 K/W the chip is able to carry 87 A at 25C. For detailed information see Application Note ANPS071E. 2) Defined by design. Not subject to production test. 3) Qualified at -5V and +20V. 4) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.1 page 3 2009-05-20 IPD50N06S3L-08 1 Power dissipation P tot = f(T C); V GS 6 V 2 Drain current I D = f(T C); V GS 6 V 120 60 100 80 40 P tot [W] 60 40 I D [A] 20 0 0 50 100 150 200 0 50 100 150 200 20 0 T C [C] T C [C] 3 Safe operating area I D = f(V DS); T C = 25 C; D = 0 parameter: t p 1000 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 101 1 s 10 s 100 0.5 100 1 ms 100 s Z thJC [K/W] 0.1 I D [A] 10-1 0.05 10 10-2 0.01 single pulse 1 0.1 1 10 100 10-3 10-7 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 1.1 page 4 2009-05-20 IPD50N06S3L-08 5 Typ. output characteristics I D = f(V DS); T j = 25 C parameter: V GS 200 10 V 8V 6 Typ. drain-source on-state resistance R DS(on) = f(I D); T j = 25 C parameter: V GS 20 5V 6V 175 6V 150 125 15 100 5V R DS(on) [m] I D [A] 10 8V 9V 10 V 75 4.5 V 50 4V 5 25 0 0 2 4 3.5 V 0 6 8 10 0 50 100 150 200 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 4 V parameter: T j 200 -55 C 25 C 175 C 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 43 A; V GS = 10 V 14 12 150 R DS(on) [m] 10 I D [A] 100 8 50 6 0 0 2 4 6 8 10 4 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 1.1 page 5 2009-05-20 IPD50N06S3L-08 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 2.5 2.25 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz Ciss 104 Coss 2 1.75 600A Crss V GS(th) [V] C [pF] 1.5 1.25 1 0.75 0.5 -60 -20 20 60A 103 102 60 100 140 180 0 5 10 15 20 25 T j [C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 103 12 Typ. avalanche characteristics I AV = f(t AV) parameter: T j(start) 100 25C 100C 102 150C I AV [A] 101 175 C 25 C I F [A] 10 100 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1 1 10 100 1000 V SD [V] t AV [s] Rev. 1.1 page 6 2009-05-20 IPD50N06S3L-08 13 Typical avalanche Energy E AS = f(T j) parameter: I D 800 12.5 A 14 Drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 65 600 60 V BR(DSS) [V] E AS [mJ] 400 25 A 55 200 50 A 50 0 0 50 100 150 200 45 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge V GS = f(Q gate); I D = 50 A pulsed parameter: V DD 12 16 Gate charge waveforms V GS 11 V 44 V 10 Qg 8 V plateau V GS [V] 6 V g s(th) 4 2 Q g (th) Q gs 0 50 100 150 Q sw Q gd Q gate 0 Q gate [nC] Rev. 1.1 page 7 2009-05-20 IPD50N06S3L-08 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2009 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.1 page 8 2009-05-20 IPD50N06S3L-08 Revision History Version Date Changes Correction of marking and update 15.06.2009 of disclaimer Data Sheet version 1.1 Data Sheet version 1.1 15.06.2009 Correction of package name Rev. 1.1 page 9 2009-05-20 |
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